A method for integrating and erecting CNT column, comprises following steps of: 1) providing a conductive layer; 2) applying a non-conductive layer over the conductive layer; 3) forming a via on the non-conductive substrate; 4) placing an electrode above the via; 5) deploying dispersive liquid containing CNT powder into the via; 6) applying a predetermined AC electric field between the conductive substrate and the electrode for integrating and erecting the CNT powder into CNT column under electric field force.