发明申请
- 专利标题： LED DEVICE WITH IMPROVED THERMAL PERFORMANCE
- 专利标题（中）： 具有改进的热性能的LED器件
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申请号： US12944895申请日： 2010-11-12
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公开(公告)号： US20120119228A1公开(公告)日： 2012-05-17
- 发明人: Hsing-Kuo Hsia , Chih-Kuang Yu , Hung-Yi Kuo , Chyi Shyuan Chern
- 申请人： Hsing-Kuo Hsia , Chih-Kuang Yu , Hung-Yi Kuo , Chyi Shyuan Chern
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.
公开/授权文献
- US08415684B2 LED device with improved thermal performance 公开/授权日：2013-04-09