发明申请
- 专利标题： UNDERFILL METHOD AND CHIP PACKAGE
- 专利标题（中）： UNDERFILL方法和芯片包
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申请号： US13358910申请日： 2012-01-26
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公开(公告)号： US20120119353A1公开(公告)日： 2012-05-17
- 发明人: Michael A. Gaynes , Rajneesh Kumar , Thomas E. Lombardi , Steve Ostrander
- 申请人： Michael A. Gaynes , Rajneesh Kumar , Thomas E. Lombardi , Steve Ostrander
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
公开/授权文献
- US08492910B2 Underfill method and chip package 公开/授权日：2013-07-23
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