发明申请
- 专利标题： SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- 专利标题（中）： 半导体器件及其形成方法
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申请号： US13289624申请日： 2011-11-04
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公开(公告)号： US20120119376A1公开(公告)日： 2012-05-17
- 发明人: Dong-Chan Lim , Gilheyun Choi , Kwangjin Moon , Deok-Young Jung , Byung-Lyul Park , Dosun Lee
- 申请人： Dong-Chan Lim , Gilheyun Choi , Kwangjin Moon , Deok-Young Jung , Byung-Lyul Park , Dosun Lee
- 优先权： KR10-2010-0114022 20101116
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Provided are a semiconductor chip and a method of manufacturing the same. The semiconductor chip includes a substrate having a first side and a second side facing each other, and a through electrode being disposed in a hole penetrating the substrate, wherein an opening surrounded by the through electrode is disposed in the hole, wherein the opening comprises a first end adjacent to the first side of the substrate and a second end adjacent to the second side of the substrate
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