- 专利标题： Connecting and Bonding Adjacent Layers with Nanostructures
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申请号： US13361436申请日： 2012-01-30
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公开(公告)号： US20120125537A1公开(公告)日： 2012-05-24
- 发明人: Mohammad Shafiqul Kabir , Andrzej Brud
- 申请人： Mohammad Shafiqul Kabir , Andrzej Brud
- 申请人地址： SE Goteborg
- 专利权人： SMOLTEK AB
- 当前专利权人： SMOLTEK AB
- 当前专利权人地址： SE Goteborg
- 主分类号： B32B37/12
- IPC分类号： B32B37/12 ; B29C39/12 ; B32B3/08
摘要：
An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.
公开/授权文献
- US08253253B2 Connecting and bonding adjacent layers with nanostructures 公开/授权日：2012-08-28
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