发明申请
US20120127681A1 SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME
审中-公开
焊接连接引线，半导体封装基板及使用其安装半导体芯片的方法
- 专利标题： SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME
- 专利标题（中）： 焊接连接引线，半导体封装基板及使用其安装半导体芯片的方法
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申请号： US13010709申请日： 2011-01-20
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公开(公告)号： US20120127681A1公开(公告)日： 2012-05-24
- 发明人: Ji Man RYU , Kwan Ho LEE , Kyu Bum HAN , Seog Moon CHOI , Jin Su KIM
- 申请人： Ji Man RYU , Kwan Ho LEE , Kyu Bum HAN , Seog Moon CHOI , Jin Su KIM
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR10-2010-0117694 20101124
- 主分类号： H01R9/00
- IPC分类号： H01R9/00 ; H05K3/00 ; H01B5/00
摘要：
Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.
信息查询
