发明申请
- 专利标题： DEFECT INSPECTION METHOD AND APPARATUS
- 专利标题（中）： 缺陷检查方法和装置
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申请号： US13362151申请日： 2012-01-31
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公开(公告)号： US20120128230A1公开(公告)日： 2012-05-24
- 发明人: Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
- 申请人： Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
- 优先权： JP10-110383 19980421; JP10-264275 19980918
- 主分类号： G06K9/00
- IPC分类号： G06K9/00
摘要：
An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer.