Invention Application
- Patent Title: PRINTED CIRCUIT BOARD CONNECTION ASSEMBLY
- Patent Title (中): 印刷电路板连接总成
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Application No.: US13209870Application Date: 2011-08-15
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Publication No.: US20120129362A1Publication Date: 2012-05-24
- Inventor: Richard J. Hampo , Slobodan Pavlovic , Nadir Sharaf , Rutunj Rai , Aftab Ali Khan
- Applicant: Richard J. Hampo , Slobodan Pavlovic , Nadir Sharaf , Rutunj Rai , Aftab Ali Khan
- Applicant Address: US MI Southfield
- Assignee: LEAR CORPORATION
- Current Assignee: LEAR CORPORATION
- Current Assignee Address: US MI Southfield
- Main IPC: H01R12/71
- IPC: H01R12/71

Abstract:
In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.
Public/Granted literature
- US08446733B2 Printed circuit board connection assembly Public/Granted day:2013-05-21
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