Invention Application
- Patent Title: USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER
- Patent Title (中): 使用包括镀金属层的石墨加热装置
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Application No.: US13366353Application Date: 2012-02-05
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Publication No.: US20120132404A1Publication Date: 2012-05-31
- Inventor: Ko-Chun CHEN , Chiu-Lang LIN
- Applicant: Ko-Chun CHEN , Chiu-Lang LIN
- Applicant Address: TW Kaohsiung City
- Assignee: WAH HONG INDUSTRIAL CORP.
- Current Assignee: WAH HONG INDUSTRIAL CORP.
- Current Assignee Address: TW Kaohsiung City
- Priority: TW098109727 20090325
- Main IPC: F28F13/00
- IPC: F28F13/00
Abstract:
The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
Public/Granted literature
- US09097468B2 Use of a graphite heat-dissipation device including a plating metal layer Public/Granted day:2015-08-04
Information query
