In a multilayer wiring board 1, a low resistance silicon substrate 2 having a predetermined resistivity and a high resistance silicon substrate 4 having a resistivity higher than the predetermined resistivity are stacked while interposing an insulating layer 3 therebetween. The low resistance silicon substrate 2 is provided with an electric passage part 6 surrounded by a ring-shaped groove 5, while a wiring film 13 electrically connected to the electric passage part 6 through an opening 8 of the insulating layer 3 is disposed on a rear face 4b of the high resistance silicon substrate 4 and an inner face 11a of a recess 11. Since the high resistance silicon substrate 4 is thus provided with the wiring film 13, an optical semiconductor element 20 and an electronic circuit element 30 which differ from each other in terms of the number and positions of electrode pads can be electrically connected to each other on the front and rear face sides of the multilayer wiring board 1.