发明申请
US20120133034A1 LEAD FRAME FOR ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
审中-公开
用于电子元件的引线框架及其制造方法
- 专利标题： LEAD FRAME FOR ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 用于电子元件的引线框架及其制造方法
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申请号： US13213882申请日： 2011-08-19
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公开(公告)号： US20120133034A1公开(公告)日： 2012-05-31
- 发明人: Ryoutarou Imura , Akira Asada
- 申请人： Ryoutarou Imura , Akira Asada
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2010-261874 20101125
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01R43/00
摘要：
In a lead frame for an electronic component according to the present invention, a metal plate 3 is extended by a punch 5 into a hole 4 formed on a metal plate 2 and the two metal plates are connected on the inner surface of the hole 4, thereby improving a bonding strength while keeping the small size and thickness of the lead frame with a simple method.
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