Invention Application
- Patent Title: MEASURING TIRE PRESSURE IN A TIRE MOLD
- Patent Title (中): 测量轮胎模具中的轮胎压力
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Application No.: US12956676Application Date: 2010-11-30
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Publication No.: US20120133086A1Publication Date: 2012-05-31
- Inventor: James Vincent Satrape , Ching-Chih Lee , David Lee Bair , Le Zhang
- Applicant: James Vincent Satrape , Ching-Chih Lee , David Lee Bair , Le Zhang
- Main IPC: B29D30/00
- IPC: B29D30/00
Abstract:
Pressure sensors may be used to directly measure the pressure between a green tire and a curing apparatus during shaping and/or during curing.
Public/Granted literature
- US09656434B2 Measuring tire pressure in a tire mold Public/Granted day:2017-05-23
Information query
