A thermal print head includes a substrate, a resistor layer supported on the substrate and provided with a plurality of heating portions arranged along a primary scanning direction, an electrode layer provided with a plurality of individual electrodes arranged along the primary scanning direction, a drive IC configured to selectively apply an electric current to the plurality of heating portions, and a plurality of wires connected to the plurality of individual electrodes and the drive IC, the plurality of individual electrodes including strip-shaped portions electrically connected to the heating portions and arranged along the primary scanning direction and pad portions greater in width in the primary scanning direction than the strip-shaped portions, the pad portions including bonding pads connected to each of the plurality of wires and probe contact pads, the probe contact pads being narrower in width in the primary scanning direction than bonding pads.