发明申请
US20120139093A1 IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT
有权
IN-SITU泡沫材料作为集成散热器(IHS)密封剂
- 专利标题: IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT
- 专利标题(中): IN-SITU泡沫材料作为集成散热器(IHS)密封剂
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申请号: US12957738申请日: 2010-12-01
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公开(公告)号: US20120139093A1公开(公告)日: 2012-06-07
- 发明人: Paul R. Start , Rahul N. Manepalli
- 申请人: Paul R. Start , Rahul N. Manepalli
- 主分类号: H01L23/427
- IPC分类号: H01L23/427 ; H01L21/50
摘要:
An integrated heat spreader (IHS) lid over a semiconductor die connected to a substrate forms a cavity. A bead of foaming material may be placed within the IHS cavity. During an IHS cure and reflow process the foaming material will expand and fill the IHS cavity and the foam's shape conforms to the various surface features present, encapsulating a thermal interface material (TIM) material, and increasing contact area of the foam sealant.
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