Invention Application
US20120139123A1 OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
有权
偏置焊接机VIAS，制造方法和设计结构
- Patent Title: OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Patent Title (中): 偏置焊接机VIAS，制造方法和设计结构
-
Application No.: US12960110Application Date: 2010-12-03
-
Publication No.: US20120139123A1Publication Date: 2012-06-07
- Inventor: Timothy H. Daubenspeck , Gary Lafontant , Ekta Misra , David L. Questad , George J. Scott , Krystyna W. Semkow , Timothy D. Sullivan , Thomas A. Wassick , Steven L. Wright
- Applicant: Timothy H. Daubenspeck , Gary Lafontant , Ekta Misra , David L. Questad , George J. Scott , Krystyna W. Semkow , Timothy D. Sullivan , Thomas A. Wassick , Steven L. Wright
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/52
- IPC: H01L23/52 ; G06F17/50 ; H01L21/44
Abstract:
Semiconductor structures, methods of manufacture and design structures are provided. The structure includes at least one offset crescent shaped solder via formed in contact with an underlying metal pad of a chip. The at least one offset crescent shaped via is offset with respect to at least one of the underlying metal pad and an underlying metal layer in direct electrical contact with an interconnect of the chip which is in electrical contact with the underlying metal layer.
Public/Granted literature
- US08298929B2 Offset solder vias, methods of manufacturing and design structures Public/Granted day:2012-10-30
Information query
IPC分类:
