发明申请
- 专利标题: METHOD AND SYSTEM FOR PACKAGING A DEVICE
- 专利标题(中): 用于包装设备的方法和系统
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申请号: US13372169申请日: 2012-02-13
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公开(公告)号: US20120140312A1公开(公告)日: 2012-06-07
- 发明人: Mark W. Miles , Jeffrey B. Sampsell
- 申请人: Mark W. Miles , Jeffrey B. Sampsell
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM MEMS TECHNOLOGIES, INC.
- 当前专利权人: QUALCOMM MEMS TECHNOLOGIES, INC.
- 当前专利权人地址: US CA San Diego
- 主分类号: G02B26/00
- IPC分类号: G02B26/00 ; H05K13/00
摘要:
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.
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