It is expected to provide an optical communication module that does not require making a conductive plate, such as a leadframe, become thinner in response to the downsizing of the photoelectric conversion device, such as a laser diode or a photodiode, and does not require downsizing a lens. A laser diode is connected and fixed to a conductive plate on the top surface of a transparent light-passing board. The light-passing board is connected and fixed to a conductive plate on the top surface of a transparent base. A first lens and a second lens are integrally formed on the top and the bottom surfaces of the base, respectively. The laser diode performs transmission of optical signals through the gap of conductive plate, the transparent light-passing board, the opening portion of a conductive plate, the opening portion of conductive plate, the first lens, the transparent base and the second lens.