发明申请
- 专利标题： CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 芯片包装及其制造方法
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申请号： US13324815申请日： 2011-12-13
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公开(公告)号： US20120146111A1公开(公告)日： 2012-06-14
- 发明人: Shu-Ming CHANG , Yen-Shih HO , Ho-Yin YIU
- 申请人： Shu-Ming CHANG , Yen-Shih HO , Ho-Yin YIU
- 主分类号： H01L29/78
- IPC分类号： H01L29/78 ; H01L21/336
摘要：
An embodiment of the invention provides a chip package including a semiconductor substrate, a drain electrode, a source electrode and a gate electrode. The semiconductor substrate has a first surface and an opposite second surface wherein the second surface has a recess. The drain electrode is disposed on the first surface and covers the recess. The source electrode is disposed on the second surface in a position corresponding to the drain electrode covering the recess. The gate electrode is disposed on the second surface. An embodiment of the invention further provides a manufacturing method of a chip package.
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