Invention Application
US20120153473A1 LEAD PIN FOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE PRINTED CIRCUIT BOARD INCLUDING THE SAME
审中-公开
用于封装衬底和半导体封装的引线包括其中的印刷电路板
- Patent Title: LEAD PIN FOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE PRINTED CIRCUIT BOARD INCLUDING THE SAME
- Patent Title (中): 用于封装衬底和半导体封装的引线包括其中的印刷电路板
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Application No.: US13046396Application Date: 2011-03-11
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Publication No.: US20120153473A1Publication Date: 2012-06-21
- Inventor: Sang Yul LEE
- Applicant: Sang Yul LEE
- Applicant Address: KR Gyunggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyunggi-do
- Priority: KR10-2010-0130993 20101220
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01B5/00
Abstract:
Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin.
Information query
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