Invention Application
- Patent Title: LOUDSPEAKER ASSEMBLY
- Patent Title (中): 扬声器总成
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Application No.: US13049984Application Date: 2011-03-17
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Publication No.: US20120155686A1Publication Date: 2012-06-21
- Inventor: JIAN-HUI LI
- Applicant: JIAN-HUI LI
- Applicant Address: HK Kowloon CN ShenZhen City
- Assignee: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- Current Assignee: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: HK Kowloon CN ShenZhen City
- Priority: CN201010589743.9 20101215
- Main IPC: H04R1/20
- IPC: H04R1/20
Abstract:
A loudspeaker assembly includes a first shell, a second shell, and a loudspeaker embedded in the first shell. Together the first shell and the second shell enclose a sound chamber. At least one of the first shell and the second shell can be folded to adjust the size of the sound chamber.
Public/Granted literature
- US08457339B2 Loudspeaker assembly Public/Granted day:2013-06-04
Information query
