发明申请
- 专利标题： SUBSTRATE TREATING APPARATUS
- 专利标题（中）： 基板处理装置
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申请号： US13401617申请日： 2012-02-21
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公开(公告)号： US20120156380A1公开(公告)日： 2012-06-21
- 发明人: Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
- 申请人： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
- 申请人地址： JP Shimogyo-ku
- 专利权人： Sokudo Co., Ltd.
- 当前专利权人： Sokudo Co., Ltd.
- 当前专利权人地址： JP Shimogyo-ku
- 优先权： JPJP2007-172496 20070629
- 主分类号： B05D3/02
- IPC分类号： B05D3/02 ; B05D3/00
摘要：
A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
公开/授权文献
- US09230834B2 Substrate treating apparatus 公开/授权日：2016-01-05
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