Invention Application
- Patent Title: GLASS CLOTH FOR PRINTED WIRING BOARD
- Patent Title (中): 印刷布线玻璃布
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Application No.: US13392461Application Date: 2010-08-25
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Publication No.: US20120156955A1Publication Date: 2012-06-21
- Inventor: Masaaki Endo , Daisuke Matsude , Susumu Ohigashi
- Applicant: Masaaki Endo , Daisuke Matsude , Susumu Ohigashi
- Priority: JP2009-195873 20090826
- International Application: PCT/JP2010/064411 WO 20100825
- Main IPC: D03D15/00
- IPC: D03D15/00

Abstract:
The present invention provides a glass cloth suitable for producing a printed wiring board to be used in the electronics and electric fields, which has small anisotropy in dimensional change and is free from warpage and twist, a prepreg using said glass cloth, and a printed wiring board using said glass cloth. The glass cloth relevant to the present invention is characterized in that the warp yarn and the weft yarn are configured with a glass yarn of 1.8×10−6 kg/m to 14×10−6 kg/m, a (breadth/length) ratio of an average filament diameter of said weft yarn to an average filament diameter of said warp yarn is 1.01 or more but less than 1.27, and a thickness is 10 μm to 40 μm.
Public/Granted literature
- US09161441B2 Glass cloth for printed wiring board Public/Granted day:2015-10-13
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