发明申请
- 专利标题: Method and System for Inter-PCB Communications with Wireline Control
- 专利标题(中): 有线控制的PCB间通信方法与系统
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申请号: US13405048申请日: 2012-02-24
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公开(公告)号: US20120159023A1公开(公告)日: 2012-06-21
- 发明人: Ahmadreza Rofougaran
- 申请人: Ahmadreza Rofougaran
- 申请人地址: US CA Irvine
- 专利权人: BROADCOM CORPORATION
- 当前专利权人: BROADCOM CORPORATION
- 当前专利权人地址: US CA Irvine
- 主分类号: G06F13/00
- IPC分类号: G06F13/00
摘要:
Aspects of a method and system for inter-PCB communications with wireline control may include setting up a microwave communication link between a first PCB and a second PCB via a wireline communication bus. The initialization may comprise adjusting beamforming parameters of a first antenna array communicatively coupled to the first PCB, and of a second antenna array communicatively coupled to the second PCB. The first PCB and the second PCB may communicate data via the microwave communication link. The microwave communication link may be routed via one or more relay PCBs, when the first PCB and the second PCB cannot directly communicate satisfactorily. Control data may be transferred between the first PCB, the second PCB, and/or the one or more relay PCBs, which may comprise one or more antennas. The relay PCBs may be dedicated relay PCBs or multi-purpose transmitter/receivers.
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