Invention Application
US20120161260A1 Method for packaging a sensor chip, and a component produced using such a method
审中-公开
用于封装传感器芯片的方法，以及使用这种方法制造的部件
- Patent Title: Method for packaging a sensor chip, and a component produced using such a method
- Patent Title (中): 用于封装传感器芯片的方法，以及使用这种方法制造的部件
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Application No.: US13334398Application Date: 2011-12-22
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Publication No.: US20120161260A1Publication Date: 2012-06-28
- Inventor: Uwe HANSEN , Lutz Rauscher
- Applicant: Uwe HANSEN , Lutz Rauscher
- Priority: DE102010064108.1 20101223
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L29/66 ; H01L21/56
Abstract:
Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.
Information query
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