Invention Application
- Patent Title: PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE
- Patent Title (中): 组装两个波形和对应装置的方法
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Application No.: US13330146Application Date: 2011-12-19
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Publication No.: US20120161292A1Publication Date: 2012-06-28
- Inventor: Aomar Halimaoui , Marc Zussy
- Applicant: Aomar Halimaoui , Marc Zussy
- Priority: FR1060839 20101220
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L21/762
Abstract:
A process for assembling a first wafer and a second wafer each bevelled on their peripheries includes excavating the bevelled peripheral part of at least one first side of the first wafer to create a deposit bordering the region excavated in the material of the first wafer. The first side and a second side of the second wafer are then bonded together.
Public/Granted literature
- US09330957B2 Process for assembling two wafers and corresponding device Public/Granted day:2016-05-03
Information query
IPC分类:
