发明申请
- 专利标题： POLISHING METHOD
- 专利标题（中）： 抛光方法
-
申请号： US13178968申请日： 2011-07-08
-
公开(公告)号： US20120164923A1公开(公告)日： 2012-06-28
- 发明人: Li Jiang , Mingqi Li
- 申请人： Li Jiang , Mingqi Li
- 申请人地址： CN Beijing
- 专利权人： Semiconductor Manufacturing International (Beijing) Corporation
- 当前专利权人： Semiconductor Manufacturing International (Beijing) Corporation
- 当前专利权人地址： CN Beijing
- 优先权： CN201010603419.8 20101223
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A polishing method is disclosed, which includes: conditioning a polishing pad, after polishing metal material of a previous wafer; spraying organic acid solution to the polishing pad; spraying deionized water to the polishing pad; performing a water-removing treatment on the polishing pad; and spraying polishing liquid to the polishing pad and polishing metal material of a next wafer. The method can prevent scratches on the surface of metal material of wafers and improve yield rate.
信息查询
