发明申请
- 专利标题: CURABLE RESIN COMPOSITION
- 专利标题(中): 可固化树脂组合物
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申请号: US13393659申请日: 2010-08-27
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公开(公告)号: US20120168215A1公开(公告)日: 2012-07-05
- 发明人: Touko Shiina , Masao Arima , Shuichi Yamamoto , Masato Yoshida
- 申请人: Touko Shiina , Masao Arima , Shuichi Yamamoto , Masato Yoshida
- 申请人地址: JP Nerima-ku, Tokyo
- 专利权人: TAIYO HOLDINGS CO., LTD
- 当前专利权人: TAIYO HOLDINGS CO., LTD
- 当前专利权人地址: JP Nerima-ku, Tokyo
- 优先权: JP2009-202598 20090902
- 国际申请: PCT/JP2010/005301 WO 20100827
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; B05D3/06 ; C08K3/30 ; B05D5/00 ; C08L63/10 ; C09D163/10
摘要:
Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.
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