Invention Application
US20120168968A1 EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE, METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
审中-公开
用于封装半导体器件的环氧树脂组合物，封装半导体器件的方法和半导体器件
- Patent Title: EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE, METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Patent Title (中): 用于封装半导体器件的环氧树脂组合物，封装半导体器件的方法和半导体器件
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Application No.: US13337410Application Date: 2011-12-27
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Publication No.: US20120168968A1Publication Date: 2012-07-05
- Inventor: Young Kyun Lee , Eun Jung Lee , Kyoung Chul Bae
- Applicant: Young Kyun Lee , Eun Jung Lee , Kyoung Chul Bae
- Priority: KR10-2010-0138323 20101229
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56 ; C08K3/36 ; C08L63/02 ; C08K3/22
Abstract:
An epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device, the composition including an epoxy resin; a curing agent; a curing accelerator; an inorganic filler; and a flame retardant; wherein the flame retardant includes boehmite, and is present in an amount of about 0.1 to 20% by weight (wt %), based on a total weight of the epoxy resin composition.
Information query
IPC分类:
