Invention Application
- Patent Title: COMPACT THERMALLY CONTROLLED THIN FILM RESISTORS UTILIZING SUBSTRATE CONTACTS AND METHODS OF MANUFACTURE
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Application No.: US13008465Application Date: 2011-01-18
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Publication No.: US20120184080A1Publication Date: 2012-07-19
- Inventor: Joseph M. LUKAITIS , Jed H. RANKIN , Robert R. ROBISON , Dustin K. SLISHER , Timothy D. SULLIVAN
- Applicant: Joseph M. LUKAITIS , Jed H. RANKIN , Robert R. ROBISON , Dustin K. SLISHER , Timothy D. SULLIVAN
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate, and forming at least one dielectric layer over the resistor. The method also includes forming a substrate contact through the at least one dielectric layer, through the resistor, through the insulator layer, and into the substrate. The substrate contact comprises a high thermal conductivity material.
Public/Granted literature
- US08298904B2 Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture Public/Granted day:2012-10-30
Information query
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