Invention Application
- Patent Title: METHOD FOR SOLDERING ELECTRONIC COMPONENTS TO A CIRCUIT BOARD BY MEANS OF HIGH-FREQUENCY SOLDERING
- Patent Title (中): 通过高频焊接将电子元件焊接到电路板的方法
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Application No.: US13050510Application Date: 2011-03-17
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Publication No.: US20120187111A1Publication Date: 2012-07-26
- Inventor: Lien-Hsing Chen , Wen-Jen Lai
- Applicant: Lien-Hsing Chen , Wen-Jen Lai
- Priority: TW100102394 20110121
- Main IPC: B23K1/002
- IPC: B23K1/002
Abstract:
A method for soldering electronic components to a circuit board by: applying a solder paste to solder contacts of a circuit board and then arranging electronic components on the circuit board to keep the pins of the electronic components in contact with the solder contacts and then a high frequency to melt the solder paste and to let the pins of the electronic components be electrically connected to the solder contacts of the circuit board electrically by the solder paste.
Information query
IPC分类:
