发明申请
- 专利标题： FORMING SEMICONDUCTOR CHIP CONNECTIONS
- 专利标题（中）： 形成半导体芯片连接
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申请号： US13432963申请日： 2012-03-28
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公开(公告)号： US20120187561A1公开(公告)日： 2012-07-26
- 发明人: Louis Lu-Chen Hsu , Kangguo Cheng , Timothy J. Dalton , Mukta G. Farooq , John A. Fitzsimmons
- 申请人： Louis Lu-Chen Hsu , Kangguo Cheng , Timothy J. Dalton , Mukta G. Farooq , John A. Fitzsimmons
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.
公开/授权文献
- US08802497B2 Forming semiconductor chip connections 公开/授权日：2014-08-12
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