发明申请
- 专利标题: ELEMENT ARRAY AND ELEMENT ARRAY LAMINATE
- 专利标题(中): 元件阵列和元件阵列层压板
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申请号: US13499458申请日: 2010-07-06
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公开(公告)号: US20120189800A1公开(公告)日: 2012-07-26
- 发明人: Takayuki Fujiwara , Seiichi Watanabe
- 申请人: Takayuki Fujiwara , Seiichi Watanabe
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM CORPORATION
- 当前专利权人: FUJIFILM CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-227249 20090930
- 国际申请: PCT/JP2010/061492 WO 20100706
- 主分类号: B32B5/00
- IPC分类号: B32B5/00
摘要:
Provided is an element array in which an error in pitch among elements in the element array is absorbed surely in a step of laminating a plurality of element arrays so that each group of the elements arrayed in the laminating direction can be aligned with high accuracy. The element array has a plurality of elements arrayed one-dimensionally or two-dimensionally, and a flexible support formed out of a material richer in elasticity than a material forming the elements. The elements are coupled with one another through the support.
公开/授权文献
- US09523798B2 Element array and element array laminate 公开/授权日:2016-12-20
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