发明申请
- 专利标题： HIGH PERFORMANCE ON-CHIP VERTICAL COAXIAL CABLE, METHOD OF MANUFACTURE AND DESIGN STRUCTURE
- 专利标题（中）： 高性能片上垂直同轴电缆，制造方法和设计结构
-
申请号： US13018963申请日： 2011-02-01
-
公开(公告)号： US20120193121A1公开(公告)日： 2012-08-02
- 发明人: Essam Mina , Guoan Wang , Wayne Harvey Woods, JR.
- 申请人： Essam Mina , Guoan Wang , Wayne Harvey Woods, JR.
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01B9/02
- IPC分类号： H01B9/02 ; H01B13/016 ; G06F17/50
摘要：
A high performance on-chip vertical coaxial cable structure, method of manufacturing and design structure thereof is provided. The coaxial cable structure includes an inner conductor and an insulating material that coaxially surrounds the inner conductor. The structure further includes an outer conductor which surrounds the insulating material. Both the inner and outer conductors comprise a plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by conductors. The coaxial cable structure is formed upon a surface of a semiconductor substrate and is oriented in substantially perpendicular alignment with the surface.
公开/授权文献
信息查询
