发明申请
- 专利标题： POWER MODULE AND THE METHOD OF PACKAGING THE SAME
- 专利标题（中）： 电源模块及其封装方法
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申请号： US13359466申请日： 2012-01-26
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公开(公告)号： US20120194148A1公开(公告)日： 2012-08-02
- 发明人: Ho-Yin YIU , Bai-Yao LOU , Chien-Hung LIU , Wei-Chung YANG
- 申请人： Ho-Yin YIU , Bai-Yao LOU , Chien-Hung LIU , Wei-Chung YANG
- 主分类号： G05F1/10
- IPC分类号： G05F1/10 ; H01L21/50
摘要：
A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.
公开/授权文献
- US09088206B2 Power module and the method of packaging the same 公开/授权日：2015-07-21
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