发明申请
- 专利标题: LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS
- 专利标题(中): 基于激光的材料加工方法与系统
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申请号: US13421372申请日: 2012-03-15
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公开(公告)号: US20120196454A1公开(公告)日: 2012-08-02
- 发明人: Lawrence Shah , Gyu Cheon Cho , Jingzhou Xu
- 申请人: Lawrence Shah , Gyu Cheon Cho , Jingzhou Xu
- 申请人地址: US MI Ann Arbor
- 专利权人: IMRA AMERICA, INC.
- 当前专利权人: IMRA AMERICA, INC.
- 当前专利权人地址: US MI Ann Arbor
- 主分类号: H01L21/26
- IPC分类号: H01L21/26 ; B23K26/38 ; H01L21/461
摘要:
Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.
公开/授权文献
- US08785813B2 Laser-based material processing methods and systems 公开/授权日:2014-07-22