发明申请
- 专利标题： CONDUCTIVE SUBSTRATE, MANUFACTURING METHOD OF CONDUCTIVE SUBSTRATE, AND LASER LIGHT IRRADIATION DEVICE
- 专利标题（中）： 导电基板，导电基板的制造方法和激光照射装置
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申请号： US13360160申请日： 2012-01-27
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公开(公告)号： US20120201953A1公开(公告)日： 2012-08-09
- 发明人: Katsuji Takagi , Yuichi Aki
- 申请人： Katsuji Takagi , Yuichi Aki
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-021634 20110203
- 主分类号： C23C16/52
- IPC分类号： C23C16/52 ; B32B3/00
摘要：
A conductive substrate includes substrate made of a resin material, and a conductive layer formed on the substrate by baking a conductive paste which is coated on the substrate at a predetermined position, wherein the conductive layer is formed through baking by applying second laser light to the conductive paste of which a position on the substrate is detected based on a difference in reflectance depending on the application positions of first laser light applied to the substrate.
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