- 专利标题: DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
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申请号: US13452109申请日: 2012-04-20
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公开(公告)号: US20120205148A1公开(公告)日: 2012-08-16
- 发明人: Satoshi YAMAMOTO , Hiroyuki HIRANO , Takanao SUZUKI
- 申请人: Satoshi YAMAMOTO , Hiroyuki HIRANO , Takanao SUZUKI
- 申请人地址: JP Tokyo
- 专利权人: FUJIKURA LTD.
- 当前专利权人: FUJIKURA LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-244396 20091023
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K3/06
摘要:
Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.