发明申请
- 专利标题： DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- 专利标题（中）： 具有通过一体化的线接触后端的装置
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申请号： US13455453申请日： 2012-04-25
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公开(公告)号： US20120205807A1公开(公告)日： 2012-08-16
- 发明人: John Boyd , Fritz Redeker , Yezdi Dordi , Hyungsuk Alexander Yoon , Shijian Li
- 申请人： John Boyd , Fritz Redeker , Yezdi Dordi , Hyungsuk Alexander Yoon , Shijian Li
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Presented are device structures and methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. Another aspect of the present invention includes three-dimensional integrated circuits fabricated according to methods of the present invention.