发明申请
- 专利标题： RESIN COMPOSITION
- 专利标题（中）： 树脂组合物
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申请号： US13371529申请日： 2012-02-13
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公开(公告)号： US20120208929A1公开(公告)日： 2012-08-16
- 发明人: Der-Gun Chou , Wen-Jeng Lee , Ta-Ming Liu , Tsung-Yi Chao
- 申请人： Der-Gun Chou , Wen-Jeng Lee , Ta-Ming Liu , Tsung-Yi Chao
- 申请人地址： US NC Pineville
- 专利权人： EVERLIGHT USA, INC.
- 当前专利权人： EVERLIGHT USA, INC.
- 当前专利权人地址： US NC Pineville
- 优先权： TW100104867 20110215
- 主分类号： C08L63/00
- IPC分类号： C08L63/00
摘要：
A resin composition for LED encapsulation is provided. The resin composition includes an epoxy resin, a curing agent and a stress adjusting agent. The resin composition of the present invention improves reliability of LED products and meets requirements in industry.