A thin film circuit board device includes a multi-layered circuit unit having an upper circuit layer formed with an upper circuit having at least one first contact part, a lower circuit layer formed with a lower circuit having at least one second contact part disposed beneath the first contact part, and an insulating layer disposed between the upper and lower circuit layers and having at least one through hole. One of the upper and lower circuit layers has at least one preformed protruding portion that protrudes into the through hole toward the other one of the upper and lower circuit layers. One of the first and second contact parts is disposed on the preformed protruding portion so as to be in constant contact with the other one of the first and second contact parts.