发明申请
- 专利标题: WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE
- 专利标题(中): 接线方法和功能设备
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申请号: US13393577申请日: 2010-09-01
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公开(公告)号: US20120217638A1公开(公告)日: 2012-08-30
- 发明人: Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
- 申请人: Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
- 申请人地址: JP Sendai-shi, Miyagi
- 专利权人: TOHOKU UNIVERSITY
- 当前专利权人: TOHOKU UNIVERSITY
- 当前专利权人地址: JP Sendai-shi, Miyagi
- 优先权: JP2009-202078 20090901
- 国际申请: PCT/JP2010/064880 WO 20100901
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/762
摘要:
By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
公开/授权文献
- US08796850B2 Wiring connection method and functional device 公开/授权日:2014-08-05