发明申请
- 专利标题: IN-MOLDED RESISTIVE AND SHIELDING ELEMENTS
- 专利标题(中): 内置电阻和屏蔽元件
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申请号: US13473301申请日: 2012-05-16
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公开(公告)号: US20120223805A1公开(公告)日: 2012-09-06
- 发明人: Ronald H. Haag , Jeffrey R. Engel , William W. Boddie, JR.
- 申请人: Ronald H. Haag , Jeffrey R. Engel , William W. Boddie, JR.
- 申请人地址: US MI Royal Oak
- 专利权人: INK-LOGIX, LLC
- 当前专利权人: INK-LOGIX, LLC
- 当前专利权人地址: US MI Royal Oak
- 主分类号: H01C1/012
- IPC分类号: H01C1/012 ; H05K9/00
摘要:
An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
公开/授权文献
- US08461957B2 In-molded resistive and shielding elements 公开/授权日:2013-06-11