A mold apparatus used in injection molding of liquid silicone composition. The mold apparatus is made of several components aiding in the overall process. The mold apparatus has two main sections, a cold section to prevent the liquid silicone from curing and a heated section for curing the liquid silicone. The two sections are separated by a thermal insulating plate. The metering of the flow is achieved by an actuator providing linear movement of a valve pin position in the center of the flow path of the runnerless nozzle resting against a gate orifice. The runnerless nozzle is keep cooled with an annular heat pipe surrounding the body of the runnerless nozzle and circulating a liquid coolant at one end of the runnerless nozzle. The cavity block receive heat from an heating element incorporated in the cavity back plate. Heat is evenly distributed in the cavity block by vaporization.