发明申请
- 专利标题： METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD
- 专利标题（中）： 制造柔性印刷电路板的方法
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申请号： US13473248申请日： 2012-05-16
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公开(公告)号： US20120227888A1公开(公告)日： 2012-09-13
- 发明人: Kyung Ho LEE , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
- 申请人： Kyung Ho LEE , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2007-133299 20071218
- 主分类号： B32B37/12
- IPC分类号： B32B37/12
摘要：
An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.
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