发明申请
- 专利标题： THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATIVE POLYMER COMPOSITIONS CONTAINING A LOW THERMALLY CONDUCTIVE FILLER AND USES THEREOF
- 专利标题（中）： 包含低导热填料的导热和电绝缘聚合物组合物及其用途
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申请号： US13402216申请日： 2012-02-22
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公开(公告)号： US20120228542A1公开(公告)日： 2012-09-13
- 发明人: Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
- 申请人： Roy l'Abee , Frans Mercx , Mark van der Mee , Dennis Karlik , Mingcheng Guo , David Zou
- 主分类号： C09K5/00
- IPC分类号： C09K5/00
摘要：
Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.
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