发明申请
- 专利标题： ADHESIVE SHEET AND ELECTRONIC COMPONENT
- 专利标题（中）： 粘合片和电子元件
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申请号： US13510821申请日： 2010-11-16
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公开(公告)号： US20120231266A1公开(公告)日： 2012-09-13
- 发明人: Takeshi Saitoh , Tomomichi Takatsu
- 申请人： Takeshi Saitoh , Tomomichi Takatsu
- 申请人地址： JP Tokyo
- 专利权人： DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- 当前专利权人： DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-271023 20091130
- 国际申请： PCT/JP2010/070348 WO 20101116
- 主分类号： B32B27/40
- IPC分类号： B32B27/40
摘要：
Provided are an adhesive sheet having a conductive die attach film that is superior in semiconductor chip-holding efficiency and pick-up efficiency and an electronic component prepared by using the adhesive sheet.An adhesive sheet, including a base film, an adhesive layer laminated on one face of the base film and a die attach film containing a conductive filler laminated on the adhesive layer, wherein the adhesive layer is shaped from a bonding composition containing a multifunctional isocyanate curing agent: 0.5 to 20 parts by mass with respect to a (meth)acrylic ester copolymer having a carboxyl group-containing monomer's copolymerization rate of less than 0.5%:100 parts by mass.
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