LED Lighting Module with Co-Molded Light Sensor

发明申请

US20120235576A1 LED Lighting Module with Co-Molded Light Sensor 审中-公开

标题翻译： LED模组与共模光传感器

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专利标题： LED Lighting Module with Co-Molded Light Sensor
专利标题（中）： LED模组与共模光传感器
申请号： US13513835

申请日： 2010-12-02
公开(公告)号： US20120235576A1

公开(公告)日： 2012-09-20
发明人: Alessandro Bizzotto , Thomas Preuschl , Alessandro Scordino
申请人： Alessandro Bizzotto , Thomas Preuschl , Alessandro Scordino
优先权： ITTO2009A000958 20091204
国际申请： PCT/EP10/68684 WO 20101202
主分类号： H05B37/02
IPC分类号： H05B37/02

LED Lighting Module with Co-Molded Light Sensor

摘要：

An LED lighting module comprising: a printed circuit board (12), at least one LED (14) connected to said printed circuit board (12), a supply circuit (16) mounted on said printed circuit board (12), a protective casing (20), made of plastic, applied to said printed circuit board (12), wherein the protective casing (20) defines a light-emitting region (28) which surrounds said at least one LED (14) and a containment region (30) in which the components of said supply circuit (16) are enclosed, and a light sensor (34) arranged to receive the light emitted by said at least one LED (14) and connected to said supply circuit (16) in which said light sensor (34) is co-molded into said protective casing (20) and faces said light-emitting region (28).

摘要（中）：

一种LED照明模块，包括：印刷电路板（12），连接到所述印刷电路板（12）的至少一个LED（14），安装在所述印刷电路板（12）上的供电电路（16）（20），其被施加到所述印刷电路板（12）上，其中所述保护壳体限定围绕所述至少一个LED（14）的发光区域（28）和容纳区域（30）），其中所述供电电路（16）的组件被封闭;以及光传感器（34），布置成接收由所述至少一个LED（14）发射并连接到所述供电电路（16）的光，其中所述光传感器（34）共同模制到所述保护壳体（20）中并面对所述发光区域（28）。

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