发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有互连的集成电路包装系统及其制造方法
-
申请号： US13069980申请日： 2011-03-23
-
公开(公告)号： US20120241931A1公开(公告)日： 2012-09-27
- 发明人: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Rachel Layda Abinan
- 申请人： Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Rachel Layda Abinan
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; embedding a circuit end of an internal interconnect in the bonding interconnect; and connecting a lead end of the internal interconnect to the lead.