发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A FLIP CHIP AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有卷芯片的集成电路包装系统及其制造方法
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申请号： US13052816申请日： 2011-03-21
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公开(公告)号： US20120241983A1公开(公告)日： 2012-09-27
- 发明人: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- 申请人： Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.
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