A moveable device foot for an electronic device is described. The device foot can include a rigid weight bearing member and a flexible sealing member that is integrally formed with the weight bearing member. The device foot can be formed using a double-shot injection molding process. The weight bearing member of the foot can be mounted to an interior portion of the electronic device such that it extends through an external casing of the electronic device. The flexible sealing member can be mounted to the external casing to seal the interior of the electronic device. During operation of the electronic device, the device foot can be configured to move relative to the external casing, such as in response to an external force applied to the electronic device.